SPHERCIAL ALUMINA POWDER FOT HIGH THERMAL CONDUCTIVE MATERIAL
This product is a spherical alumina powder with high globularity with high thermal conductivity, developed by high temperature melting technologies and indicates excellent characteristics for rubber and plastic filler and ceramic base material.
Character:
2. High thermal conductivity: High filling density enables production of compounds with higher thermal conductivity and higher heat dissipation rate compared to crystalline silica.
3. Low abrasivity: Due to its Spherical shape, less-wearing of kneading machines, forming machines and dies.
Applications:
1. Filler for heat sink sheet, filler for heat dissipation board (MC board), heat dissipating
grease, phase change sheet
2. Filler for semiconductor sealing resin
3. Silicone-based heat dissipating adhesive, filler for compound
4. Ceramic filler
Specifications:
Type | D50（um） | S.S.A.(m2/g) |
SA-05 | 5±1 | 0.60 |
SA-10 | 10±2 | 0.50 |
SA-20 | 20±3 | 0.40 |
SA-30 | 30±3 | 0.30 |
SA-40 | 40±5 | 0.20 |
SA-70 | 70+/-6 | 0.12 |
Physical Property:
Appearance | White powder |
Specific Gravity (g/cm3) | 3.60 |
Melting point (℃) | 2050 |
Moisture (%) | ≤ 0.05 |
EC（uS/cm） | ≤ 10 |
PH | 7.0±0.5 |
α-Al2O3 Cotent（%） | ≥ 90 |
Spherical particles ratio（%） | ≥ 95 |
Chemical Property:
Type | Chemical Composition | ||||||
Al2O3% ≥ | SiO2% ≤ | Fe2O3% ≤ | Na2O%≤ | K2O% ≤ | MgO%≤ | CaO% ≤ | |
SA-05 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
SA-10 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
SA-20 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
SA-30 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
SA-40 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
SA-70 | 99.0 | 0.05 | .05 | 0.02 | 0.01 | 0.01 | 0.01 |
SPHERCIAL ALUMINA POWDER FOT HIGH THERMAL CONDUCTIVE MATERIAL
This product is a spherical alumina powder with high globularity with high thermal conductivity, developed by high temperature melting technologies and indicates excellent characteristics for rubber and plastic filler and ceramic base material.
Character:
2. High thermal conductivity: High filling density enables production of compounds with higher thermal conductivity and higher heat dissipation rate compared to crystalline silica.
3. Low abrasivity: Due to its Spherical shape, less-wearing of kneading machines, forming machines and dies.
Applications:
1. Filler for heat sink sheet, filler for heat dissipation board (MC board), heat dissipating
grease, phase change sheet
2. Filler for semiconductor sealing resin
3. Silicone-based heat dissipating adhesive, filler for compound
4. Ceramic filler
Specifications:
Type | D50（um） | S.S.A.(m2/g) |
SA-05 | 5±1 | 0.60 |
SA-10 | 10±2 | 0.50 |
SA-20 | 20±3 | 0.40 |
SA-30 | 30±3 | 0.30 |
SA-40 | 40±5 | 0.20 |
SA-70 | 70+/-6 | 0.12 |
Physical Property:
Appearance | White powder |
Specific Gravity (g/cm3) | 3.60 |
Melting point (℃) | 2050 |
Moisture (%) | ≤ 0.05 |
EC（uS/cm） | ≤ 10 |
PH | 7.0±0.5 |
α-Al2O3 Cotent（%） | ≥ 90 |
Spherical particles ratio（%） | ≥ 95 |
Chemical Property:
Type | Chemical Composition | ||||||
Al2O3% ≥ | SiO2% ≤ | Fe2O3% ≤ | Na2O%≤ | K2O% ≤ | MgO%≤ | CaO% ≤ | |
SA-05 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
SA-10 | 99.0 | 0.05 | 0.05 | 0.03 | 0.02 | 0.01 | 0.01 |
SA-20 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
SA-30 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
SA-40 | 99.0 | 0.05 | 0.05 | 0.02 | 0.01 | 0.01 | 0.01 |
SA-70 | 99.0 | 0.05 | .05 | 0.02 | 0.01 | 0.01 | 0.01 |
